PCB surface finish is a coating applied to the exposed copper areas of a printed circuit board to protect the copper from oxidation and ensure good solderability. The choice of surface finish affects the PCB's performance, cost, and shelf life.
Jichangsheng Technology supports all major surface finishes. Our team can help you select the best surface finish for your application.
| Surface Finish | Type | Flatness | Cost | Shelf Life |
|---|---|---|---|---|
| HASL | Lead-free/Leaded | Poor | Low | 12 months |
| ENIG | Lead-free | Excellent | Medium-High | 12 months |
| OSP | Lead-free | Excellent | Low | 3-6 months |
| Immersion Tin | Lead-free | Excellent | Medium | 6 months |
| Immersion Silver | Lead-free | Excellent | Medium | 6-12 months |
| ENEPIG | Lead-free | Excellent | High | 12 months |
The most common and cost-effective surface finish. Molten solder is applied to the PCB and then leveled with hot air knives. Lead-free HASL uses SAC alloy (SnAgCu). Suitable for most applications.
A two-layer metallic coating of nickel and gold. The nickel layer acts as a barrier to copper and provides a hard surface. The gold layer protects the nickel during storage and provides a solderable surface.
A water-based organic compound that selectively bonds to copper and provides an organometallic layer that protects the copper until soldering. Very flat surface finish.
A thin layer of tin deposited directly on the copper surface. Provides a flat, solderable surface. Suitable for press-fit connectors.
A thin layer of silver deposited on the copper surface. Provides excellent solderability and a flat surface. Suitable for high-frequency applications.
A three-layer coating of nickel, palladium, and gold. Eliminates the black pad issue associated with ENIG. Suitable for wire bonding and fine pitch applications.