Rigid PCB Capabilities

Jichangsheng Technology provides 1-20 layers quick-turn FR4 Printed Circuit Boards (PCBs) manufactured with top brand FR4 copper clad lamination materials to reach the highest quality at the reasonable pricing. Whether you need a few quick turn PCB prototypes or mass production as per IPC standards, ISO 9001:2015, ISO 14001:2015 and RoHS standards, our world class manufacturing can meet your specialized PCB needs.

The FR4 rigid PCB manufacturing capabilities below is designed to help you understand if our capabilities are a match for your PCB design, including standard and heavy copper PCB, and it will also allow you to plan ahead and create your PCB design within these capabilities so that you can be sure we can build your PCB board.

FR-4 PCB Manufacturing Capabilities

ItemStandard PCBHDI PCB
Layer Count1-20 Layers4-20 Layers
Max Board Size500mm x 600mm400mm x 500mm
Min Board Size5mm x 5mm5mm x 5mm
Board Thickness0.4-6.0mm0.4-3.2mm
Thickness Tolerance±10%±10%
Min Trace Width3mil (0.075mm)2.4mil (0.06mm)
Min Trace Space3mil (0.075mm)2.4mil (0.06mm)
Min Drill Diameter0.2mm (8mil)0.075mm (3mil)
Min Laser Drill DiameterN/A0.075mm (3mil)
Finished Hole Diameter0.15mm (6mil) min0.075mm (3mil) min
Aspect Ratio10:110:1
Copper Weight (Outer)1/2oz - 10oz1/2oz - 3oz
Copper Weight (Inner)1/2oz - 3oz1/2oz - 2oz
Surface FinishHASL, ENIG, OSP, ENEPIG, Immersion Tin/SilverENIG, ENEPIG
Solder MaskGreen, Red, Blue, Black, White, YellowGreen, Black
SilkscreenWhite, Black, YellowWhite, Black
Controlled Impedance±10%±10%
Blind/Buried ViaYesYes
Via-in-PadYesYes
Gold FingersYesYes
Edge PlatingYesYes
Peelable MaskYesYes
Carbon InkYesNo
Countersink/CounterboreYesNo